15
Patents represented
Technical areasPatents
Semiconductors8
Audio-visual technology3
Electrical machinery, apparatus, energy3
Handling2
Medical technology1

Countries of applicants

Summary

AIKIN, Jacob T. is very experienced in the technologies „Semiconductors“ and „Electrical machinery, apparatus, energy“. 93% of all patents are related to „Electrical engineering“. Most important clients are „LUXVUE TECHNOLOGY CORPORATION“ and „INTEL CORPORATION“. AIKIN, Jacob T. was very active in 2014 and 2013. Oftentimes, clients are from United States.

Patents by year

Patents by area

14
Patent applications
1
Patent applications
1
Patent applications
2
Patent applications

Patents by applicant

RankNameCountryPatents
1LUXVUE TECHNOLOGY CORPORATIONUnited States8
2INTEL CORPORATIONIndia5
3APPLE INC.United States1
4BAYER ESSURE INC.United States1

Latest patents

Publication numberTitlePatent applicantYear
WO2014149602HYDRATION PREVENTION COATINGBAYER ESSURE INC.
2014
WO2014149864LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME AND METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATED DEFECT DETECTION TESTLUXVUE TECHNOLOGY CORPORATION
2014
WO2014130353MASS TRANSFER TOOL MANIPULATOR ASSEMBLY AND MICRO PICK UP ARRAY MOUNT WITH INTEGRATED DISPLACEMENT SENSORLUXVUE TECHNOLOGY CORPORATION
2014
WO2014099499SMART PIXEL LIGHTING AND DISPLAY MICROCONTROLLERLUXVUE TECHNOLOGY CORPORATION
2014
WO2014093063LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURELUXVUE TECHNOLOGY CORPORATION
2014
WO2014093064ACTIVE MATRIX EMISSIVE MICRO LED DISPLAYLUXVUE TECHNOLOGY CORPORATION
2014
WO2014093065ACTIVE MATRIX DISPLAY PANEL WITH GROUND TIE LINESLUXVUE TECHNOLOGY CORPORATION
2014
WO2014093241MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNTLUXVUE TECHNOLOGY CORPORATION
2014
WO2014093243MICRO PICK UP ARRAY WITH INTEGRATED PIVOT MOUNTLUXVUE TECHNOLOGY CORPORATION
2014
WO2013095466INTEGRATION OF ENERGY STORAGE DEVICES ONTO SUBSTRATES FOR MICROELECTRONICS AND MOBILE DEVICESINTEL CORPORATION
2013
WO2013089710OVERCOMING VARIANCE IN STACKED CAPACITORSINTEL CORPORATION
2013
WO20130625903D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED WITH FINE PITCH BACKSIDE METAL REDISTRIBUTION LINES FABRICATED USING A DUAL DAMASCENE TYPE APPROACHINTEL CORPORATION
2013
WO20130625933D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BACKSIDE METAL REDISTRIBUTION LINES COMBINED WITH THROUGH-SILICON VIASINTEL CORPORATION
2013
WO2013048473FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESSINTEL CORPORATION
2013
WO2012166990SYSTEM AND METHOD FOR SECURE INSTANT MESSAGINGAPPLE INC.
2012